Make Homepage  | Add To Favorites  | Print Page | Contact
     More Technical Information Than You Can Handle. 
 

.
 

IEDM 2020 Marks Key Process and Packaging Innovations

  
p>Robert Chau Intel Senior Fellow Director, Components Research By Robert Chau The International Electron Devices Meeting (IEDM), hosted every year since 1954 by the Institute of Electrical and Electronics Engineers (IEEE), is undoubtably the world’s premier conference for breakthrough semiconductor technologies. Intel researchers made 19 presentations at this week’s IEDM 2020, demonstrating breakthroughs in various …...

- View Press Release
- Visit Intel Corporation

 Intel-Press
Posted: December 18, 2020 |  By: Wissen Schwamm
Recent Intel-Press related news.
Intel Names Dawn Jones CDIO and VP of Social Impact
Mobileye and Udelv Ink Deal for Autonomous Delivery
SD Supercomputer Center Selects Habana, Intel for Efficient AI
Leveraging Technology to Provide Global Pandemic Relief
April Intel Partner Connect 2021 (Virtual)
+ View more Intel-Press related news +
     

Copyright © 2021 Nerd Press All Rights Reserved. | Last Updated: December 5, 2021
CCBot/2.0 (https://commoncrawl.org/faq/)