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Intel Wins US Government Advanced Packaging Project

 
p>What’s New:┬áThe U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The SHIP program enables the U.S. government to access Intel’s state-of-the-art semiconductor packaging capabilities in Arizona and Oregon and take advantage of capabilities created by Intel’s tens of billions of dollars of annual …...

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Posted: October 2, 2020 |  By: Wissen Schwamm
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