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Up Close with Lakefield – Intel’s...

 
p>The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with …...

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Intel-Press
Posted: February 11, 2020 |  By: Wissen Schwamm
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