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Intel’s Mix and Match Innovation (Infographic)

 
p>Today, at the annual Hot Chips Conference in Cupertino, California, Intel presented details about the company’s EMIB (Embedded Multi-die Interconnect Bridge) packaging technology.┬áDeveloped by Intel, EMIB facilitates high-speed communication between multiple die in-package, and is a key component of Intel’s mix-and-match heterogeneous computing strategy. EMIB is used in Intel® Stratix® 10 FPGAs and 8th Gen …...

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Intel-Press
Posted: August 20, 2018 |  By: Wissen Schwamm
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