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Micron and Intel Announce Update to 3D XPoint...

 
p>BOISE, Idaho, and SANTA CLARA, Calif., July 16, 2018 – Micron and Intel today announced an update to their 3D XPoint™ joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory. The companies have agreed to complete …...

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Posted: July 16, 2018 |  By: Wissen Schwamm
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