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Micron and Intel Extend Their Leadership in 3D...

 
p>News Highlights Intel-Micron delivers the 1st commercially available 1Tb - 4bits/cell (QLC) die in the history of semiconductors Qualification of 4bits/cell 3D NAND on 64 layer 2nd Gen 3D NAND has been completed. 4bits/cell (QLC) provides 33% higher density compared to 3bits/cell (TLC) 3rd Generation 3D NAND uses 96 layers to maintain cost/density leadership 3RD Generation …...

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Intel-Press
Posted: May 21, 2018 |  By: Wissen Schwamm
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