Micron and Intel Extend Their Leadership in 3D NAND Flash Memory

	Micron and Intel Extend Their Leadership in 3D...

p>News Highlights Intel-Micron delivers the 1st commercially available 1Tb - 4bits/cell (QLC) die in the history of semiconductors Qualification of 4bits/cell 3D NAND on 64 layer 2nd Gen 3D NAND has been completed. 4bits/cell (QLC) provides 33% higher density compared to 3bits/cell (TLC) 3rd Generation 3D NAND uses 96 layers to maintain cost/density leadership 3RD Generation …...

- View Press Release
- Visit Intel Corporation

Posted: May 21, 2018 | By: Wissen Schwamm

Recent Intel-Press related news.

Intel Builds World’s Largest Neuromorphic System to Enable More Sustainable AI

Intel Brings AI-Platform Innovation to Life at the Olympic Games

Intel Unleashes Enterprise AI with Gaudi 3, AI Open Systems Strategy and New Customer Wins

Intel to Report First-Quarter 2024 Financial Results

Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion

+ View more Intel-Press related news +

			More Technical Information Than You Can Handle.

Micron and Intel Extend Their Leadership in 3D...