Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

	Up Close with Lakefield – Intel’s...

p>The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with …...

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Posted: February 11, 2020 | By: Wissen Schwamm

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Up Close with Lakefield – Intel’s...