Intel Technology and Manufacturing Day in China Showcases 10 nm Updates, FPGA Progress and Industry’s First 64-Layer 3D NAND for Data Center

	Intel Technology and Manufacturing Day in China...

p>Intel delivered key updates at its Technology and Manufacturing Day held in Beijing, China, on Sept. 19. Disclosures included power and performance updates for Intel’s 10 nm process, high-level plans for Intel’s first 10 nm FPGA, and an announcement that the company is shipping the industry’s first commercially available 64-layer 3D NAND for data center …...

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Posted: September 19, 2017 | By: Wissen Schwamm

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Intel Technology and Manufacturing Day in China...